- Part Status：
-
- Shape：
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- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
- Filter：
136 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
714
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
543
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
54
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,178
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1 |
4,113
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
22,235
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
1 |
3,234
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
2,354
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,039
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,582
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,588
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,588
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
1,814
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
1 |
3,753
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
2,169
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,970
In-stock
|
Get Quote |
