Product overview
- Product number
- HSS05-C20-SMT-TR
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, STAMPING, TO-220, 12.
Documents and media
- Datasheets
- HSS05-C20-SMT-TR
Product Details
- Attachment Method :
- -
- Diameter :
- -
- Material :
- Copper Alloy
- Material Finish :
- Tin
- Package Cooled :
- TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 2.3W @ 75°C
- Shape :
- Rectangular
- Thermal Resistance @ Forced Air Flow :
- 14.00°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 32.69°C/W
- Type :
- Board Level, Vertical
product description
HEAT SINK, STAMPING, TO-220, 12.
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