Product overview
- Product number
- HSS08-B18-CP
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, STAMPING, TO-218, 44.
Documents and media
- Datasheets
- HSS08-B18-CP
Product Details
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 10.3W @ 75°C
- Shape :
- Square
- Thermal Resistance @ Forced Air Flow :
- 3.50°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 7.29°C/W
- Type :
- Board Level, Vertical
product description
HEAT SINK, STAMPING, TO-218, 44.
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