Product overview
- Product number
- HSB01-080808
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Documents and media
- Datasheets
- HSB01-080808
Product Details
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 1.9W @ 75°C
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 16.00°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 39.10°C/W
- Type :
- Top Mount
product description
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
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