Product overview
- Product number
- TS391LT50
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- THERMALLY STABLE SOLDER PASTE NO
Documents and media
- Datasheets
- TS391LT50
Product Details
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 1.76 oz (50g)
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
THERMALLY STABLE SOLDER PASTE NO
Recommended Products
You may be looking for
GCM155R71C683MA55D
Q-2V00J0003084I
T495C156K020ATE375
TAJE687M006RNJ
293D227X0010E2TE3
04025A3R3BAT4A
357-016-547-178
ESA31DTAT
Q-2W0140003084I
ASM22DRTF
GRM033C80J123ME01J
0603N1R1C500CT
Q-3E04V000D0.5M
387-034-560-201
Q-7104E0005108I
T494C225K035AT
GCM155R71H683ME02D
Q-3C01O000R0.5M
F911A227KNCAJ6
TLCR476M010XTA
