Product overview
- Product number
- 4900P-25G
- Manufacturer
- MG Chemicals
- Catalog
- Solder
- product description
- LEAD FREE NO CLEAN SOLDER PASTE
Documents and media
- Datasheets
- 4900P-25G
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 0.88 oz (25g)
- Melting Point :
- 423 ~ 430°F (217 ~ 221°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 24 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 35°F ~ 50°F (2°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
LEAD FREE NO CLEAN SOLDER PASTE
Recommended Products
You may be looking for
0387306618
MS27474T18Z28BB
8D7Q25ZC82SN408
350-10-107-01-666101
8D7Q17K82PD408
562013060
MS27474T16F99AA
YK6611633000G
MS27474T22B55BC
850-10-009-40-001101
HTSW-101-25-S-T-RA
T37120-08-0
8DA511W22PN
8D7Q25K82PD621
MS27484E20B39SD-LC
TMM-103-04-F-D
0387307316
8D7Q25ZC82SN621
MS27474T18Z28BC
3-647184-7