Datasheets

4900P-250G

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Jar, 8.8 oz (250g)

Melting Point :

423 ~ 430°F (217 ~ 221°C)

Mesh Type :

-

Part Status :

Active

Process :

Lead Free

Shelf Life :

24 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

35°F ~ 50°F (2°C ~ 10°C)

Type :

Solder Paste

Wire Gauge :

-