Product overview
- Product number
- NC191LTA50
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SMOOTH FLOW LOW TEMP SOLDER PAST
Documents and media
- Datasheets
- NC191LTA50
Product Details
- Composition :
- Bi57Sn42Ag1 (57/42/1)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 1.76 oz (50g)
- Melting Point :
- 279°F (137°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- -
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SMOOTH FLOW LOW TEMP SOLDER PAST
Recommended Products
You may be looking for
IDSD-05-D-06.50-P03
807-032-459-104
C330C223F2G5TA7301
895-140-558-504
SMCG20AHE3/9AT
C328C683F3G5TA7301
TCMD-05-S-12.00-01-SR
895-058-524-402
CDR31BP511AFUS-ZANAM
SFSDT-05-30-G-10.00-D-NUS
A3AAH-3436M
842-110-544-203
C333C683F1G5TA7301
1.5KE6.8CA-E3/73
SMCJ13CA-M3/57T
IDSD-05-D-14.00-T
807-032-431-107
895-140-559-502
C330C153FAG5TA7301
SMCG22AHE3/9AT
