Product overview
- Product number
- SMDAL200
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- ALUMINUM SOLDER PASTE WATER-SOLU
Documents and media
- Datasheets
- SMDAL200
Product Details
- Composition :
- Sn96.5Ag3.5 (96.5/3.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 7.05 oz (200g)
- Melting Point :
- 430°F (221°C)
- Mesh Type :
- 3
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
ALUMINUM SOLDER PASTE WATER-SOLU
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