- Part Status：
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- Shape：
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- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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- Material Finish：
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- Filter：
136 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
466
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
654
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
249
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
162
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
678
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
635
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
1 |
598
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
587
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
293
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
1 |
422
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
338
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
1 |
781
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
382
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
200
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
285
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
624
In-stock
|
Get Quote |
